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J5850 Double-Sided Grinding Machine
J5850 Double-Sided Grinding Machine
Keyword:
- Product description
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This equipment is used for grinding discs of silicon, germanium, ceramics, magnetic materials, etc.
1. Working size:
(1) Maximum diameter (mm): Φ65 or 45X45
(2) Workpiece thickness (mm): 0.25~5.0
2. Workpiece precision:
The maximum error of the workpiece in the same grinding disc
(1) Parallelism (mm): ≤0.001(2) Straightness (mm): ≤0.001
(3) Roughness (um): above Ra0.80
(4) Thickness difference between workpieces: <±0.005~0.0083. Number of planetary gears: 5 pieces
4. Productivity
Taking silicon wafer diameter Φ30 as an example, the most suitable workpiece grinding amount is 60μ, and the productivity is 120150 pieces/hour.
5. Speed
The internal gear speed is 0~40r/min, and the frequency converter is used to adjust the speed of the AC motor.6. Power
(1) Frequency conversion and speed regulation three-phase AC motor of the main turbine reducer of the drag grinding device
Rated power: 0.75Kw
Rated voltage: 220V
Rated speed: 1500r/min
(2) AC motor for abrasive mixing
Rated power: 90W, 1400r/min, 380V
Rated voltage: 380V
Rated speed: 1400r/min
7. Machine power consumption (Kw): 1.5
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